陶瓷基板研磨机的原理主要基于机械摩擦与材料去除的协同作用，通过精密控制的研磨工具与陶瓷基板表面的相对运动，实现高精度、低损伤的表面加工。其核心原理可分解为以下关键环节：

1. 研磨介质与作用力

• 研磨工具：通常采用金刚石、碳化硅（SiC）或氧化铝（Al₂O₃）等超硬材料制成的磨盘或磨粒，其硬度远高于陶瓷基板（如氧化铝、氮化铝、氧化锆等），确保有效去除材料。

• 作用力类型：

  • 法向力：垂直于基板表面的压力，使磨粒嵌入基板表面，产生塑性变形或脆性断裂。

  • 切向力：平行于表面的摩擦力，驱动磨粒滑动或滚动，剥离破碎的材料层。

  
  

2. 材料去除机制

陶瓷基板的研磨过程结合了脆性断裂与塑性流动两种机制，具体取决于材料特性、研磨参数及磨粒尺寸：

• 脆性断裂：陶瓷为脆性材料，当磨粒压入表面时，裂纹在基板内部扩展并交汇，导致小块材料剥落（微破碎）。此机制在粗研磨阶段占主导。

• 塑性流动：通过优化研磨参数（如低压力、小磨粒、高转速），可使陶瓷表面产生局部塑性变形，形成光滑层（类似金属的切削加工）。此机制在精研磨阶段更显著，可减少表面损伤。

3. 运动方式与轨迹控制

研磨机通过精确控制研磨工具与基板的相对运动，实现均匀材料去除：

• 单轴旋转研磨：磨盘绕固定轴旋转，基板固定或做行星运动，适用于平面研磨。

• 双轴联动研磨：磨盘与基板同时旋转（如自旋转研磨），通过调整转速比优化表面均匀性。

• 轨迹规划：通过数控系统控制磨盘或基板的摆动、振动或往复运动，避免局部过度研磨，提升表面平整度。

4. 冷却与润滑系统

• 冷却液作用：

  • 散热：研磨产生大量热量，冷却液（如水基或油基溶液）可防止基板热变形或磨粒钝化。

  • 排屑：携带研磨碎屑离开加工区，避免二次划伤。

  • 润滑：减少磨粒与基板间的摩擦，降低表面粗糙度。

  
  

• 喷淋方式：通过喷嘴均匀喷射冷却液，或采用浸没式研磨（基板完全浸入冷却液中）。

5. 工艺参数优化

• 研磨压力：压力过大易导致裂纹扩展，压力过小则效率低下，需根据材料硬度调整。

• 磨粒尺寸：粗磨用大颗粒（如#200-#400），精磨用小颗粒（如#1000以上），逐步降低表面粗糙度。

• 研磨速度：高转速可提高效率，但需平衡离心力对加工稳定性的影响。

• 加工时间：通过在线检测（如激光干涉仪）实时监控表面质量，避免过度研磨。

6. 表面质量提升技术

• 化学机械抛光（CMP）：在研磨液中添加化学试剂（如酸性或碱性溶液），通过化学反应软化陶瓷表面，结合机械作用实现超光滑加工（Ra<0.1μm）。

• 超声波辅助研磨：利用高频振动使磨粒产生微冲击，改善材料去除均匀性，尤其适用于难加工陶瓷。

应用场景

陶瓷基板研磨机广泛应用于电子封装、功率器件、LED照明等领域，用于制备高平整度、低粗糙度的基板表面，以满足后续金属化、芯片贴装等工艺要求。例如，氮化铝（AlN）基板需通过研磨去除烧结缺陷，确保高导热性与绝缘性。

通过上述原理的协同作用，陶瓷基板研磨机能够实现纳米级表面粗糙度控制，同时保持基板的机械强度与电学性能，是高端陶瓷电子器件制造的关键设备。

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What are the advantages of vacuum plug hole machine? 1. Selective plugging can be performed; 2. Completely solve the problems of bubbles and voids in high aspect ratio boards; 3. The aspect ratio can reach 1:30; 4. Automated operation interface, user-friendly, and easy to operate; The vacuum plug hole machine is used for the process of plugging conductive and non-conductive resin ink holes. After plugging, the holes are full, without depressions or bubbles. Suitable for selective through-hole, blind hole, back drilling and other types of plug hole processes. Suitable for silver paste, copper paste, conductive adhesive, imported and domestic resin ink. The vacuum plug hole machine can complete all the holes that need to be plugged at once without any large or small hole requirements. In addition, it is equipped with a scraper that can scrape off excess resin on the surface, reducing the difficulty of grinding. What are the characteristics of the control system of the vacuum plug hole machine? Multi functional vacuum hole plug machine manufacturer

In the process of producing and manufacturing PCB boards, some PCB boards need to be plugged. The traditional production method is to use screen printing to place resin or other required working materials on the PCB mesh board and cooperate with a scraper or scraper to move back and forth, inserting resin and other materials into the holes of the PCB board. However, this method may not be able to quickly and accurately fill the required materials into the holes due to the influence of bubbles when the hole diameter becomes smaller, the board becomes thicker, or even blind holes. In addition, there may be air or bubbles in the filled working material, which can easily cause the working material in the holes to bulge, sink or be discontinuous. Therefore, vacuum plugging machines are generally used now. PCB that will require plug holes The board is placed in the vacuum chamber, and after the vacuum unit is evacuated, the silk screen plug hole mechanism in the vacuum chamber is used to quickly and accurately fill the holes. The excess ink is scraped back to the starting position using a return oil scraper, and then the PCB board is removed through the table sealing conversion mechanism. By using vacuum plug holes, the original defects such as bubbles, dents, or discontinuities are avoided. The Zhuhai copper paste vacuum plug machine is recommended to ensure that there are no bubbles generated during resin plug hole printing.

What is the function of using a vacuum plug hole machine for PCB circuit boards? In the process of designing PCB circuit boards, although the size of solder pads and vias will gradually decrease, if the board thickness is not proportionally reduced, it will increase the aspect ratio of vias, leading to a decrease in reliability. Due to the advancement of laser drilling technology and plasma dry etching technology, smaller blind holes and buried holes can be manufactured. If the diameter of these non through holes is 0.3mm, the parasitic parameters will be about 1/10 of the original conventional holes, significantly enhancing the reliability of the PCB. Due to the adoption of non through-hole technology, there will be fewer large holes and larger spacing for PCB wiring. The remaining space can be used for large-area shielding to improve EMI/RFI performance. In addition, more remaining space can also be used in the inner layer to partially shield equipment and critical network cables, thereby improving electrical performance. The use of non through holes makes it easier for component pins to fan out, which helps high-density pin devices (such as BGA packaging devices) to trace and reduce wiring length, meeting the timing requirements of high-speed circuits.

With the development of electronic products towards "light, thin, short, and small" direction, PCBs are also developing towards high density and high difficulty, resulting in a large number of SMT and BGA PCBs. Customers require plug holes when mounting components, and vacuum plug hole machines can be used for PCBs. The specific functions are as follows: 1. To prevent short circuits caused by tin passing through the component surface through the via holes during PCB wave soldering; Especially when we place vias on BGA pads, we must first make plug holes and then gold plating to facilitate BGA soldering. 2. Avoid leaving solder flux in the conductive holes; 3. After the surface mount and component assembly of the electronic factory are completed, the PCB needs to be vacuumed on the testing machine to form negative pressure before it can be completed; 4. Prevent surface solder paste from flowing into the holes and causing virtual soldering, which may affect the mounting process; 5. Prevent tin beads from popping out during wave soldering, causing short circuits. The vacuum plug hole machine is suitable for resin ink, silver paste, copper paddle, and conductive adhesive.

The function of the vacuum plug hole machine is to fix the circuit board and mesh board to the horizontal plug hole platform with a fixture. After the vacuum door is closed, start vacuuming. Vacuumize for about fifteen seconds to reach the vacuum level! The piston controlled by air pressure squeezes ink through the mesh plate into the holes on the plate. The ink is placed in a reusable ink holder. Different sizes of boards can use different sizes of plug heads! The vertical movement is controlled by a servo motor. All process parameters can be saved as menus, and the touch screen display can store up to fifty menus! The working principle of the vacuum plug hole machine: Ink can be placed in standard 12 ounce or 6 ounce or smaller ink cartridges! The ink in the ink holder is compressed into the plug hole head by a pneumatic pressure piston. This machine can use different plug sizes, but if the plug size is larger than six inches, a larger pressure system must be used to evenly deliver ink to every part of the 24 inch plug. The vacuum plug hole machine can complete all the holes that need to be plugged at once, without any large or small hole requirements. Zhuhai Resin Hole Plug Machine Company

What are the advantages of vacuum plug hole machine? Multi functional vacuum hole plug machine manufacturer

The mechanism of the vacuum resin plugging machine is that during the plugging process, the resin constantly comes into contact with air, and the air is trapped inside the resin, causing it to stay in the hole after plugging. For screen plug holes, due to the resin being dispersed through the screen and then merged when entering the holes, the number of bubbles in the plug holes is relatively higher than that in aluminum sheet plug holes. For vacuum plugging machines, the plugging process is in a vacuum state, and the resin does not come into contact with air. There are no bubbles trapped in the resin, so no plugging bubbles are generated. Of course, the so-called vacuum is not necessarily true. In fact, there are still trace amounts of air, and during the resin recovery process, there is manual stirring, which can also introduce trace bubbles into the resin. Therefore, if the resin is reused without defoaming, there will also be a small amount of air bubbles in the vacuum plug hole. Multi functional vacuum hole plug machine manufacturer