真空树脂塞孔机是一种专业用于PCB（印刷电路板）制造的关键设备，通过真空技术填充孔洞（如通孔、盲孔等），确保孔洞绝缘性、稳定性和无气泡缺陷。

以下是其主要介绍：Resin vacuum screen printing plug hole machine | Vacuum resin plug hole machine | Vacuum screen printing plug hole machine | Vacuum horizontal screen printing plug hole machine | Vacuum horizontal scr

工作原理‌：设备在无气环境下抽取孔洞空气形成负压（真空度可达15-50Pa），再填充树脂或油墨，避免气泡和空洞，保证填充饱满均匀。

核心特点‌：

高真空系统：极限真空度达15-20Pa，彻底消除孔内气孔和凹陷问题，适用于高纵横比（如80:1）生产。

自动化设计：集成CCD对位系统，精度达0.02mm，一键设定参数（如塞孔压力、速度），减少人工依赖。

高效产能：双台面结构提升产能1.5-2倍，日增产1000-2000片板，大幅缩短调机时间至30分钟内。

操作便利：兼容各类PCB板（硬板、软板、载板），支持网板自动清洁和油墨添加功能。

应用场景‌：主要用于PCB多层板、HDI板、IC载板等的树脂、铜胶或银胶填充，处理通孔、盲孔、背钻孔等复杂工艺。

性能规格‌：

基板尺寸：**825×1100mm，最小50×150mm；厚度范围0.1-8mm。

塞孔能力：通孔径0.1-2.0mm（纵横比30:1），盲孔径0.05-0.5mm（纵横比5:1）。

产能：每小时20-40片，视板厚和真空度调整。

发展趋势‌：向全自动化升级，如黑灯式方案整合研磨线，结合AGV或机械手实现无人化生产。

The vacuum resin plug hole machine is a key equipment specialized in PCB (printed circuit board) manufacturing, which uses vacuum technology to fill holes (such as through holes, blind holes, etc.) to ensure hole insulation, stability, and no bubble defects.

Here is its main introduction:

twenty million two hundred and fifty thousand eight hundred and fifteen

Working principle: The equipment extracts air from the holes in a airless environment to create negative pressure (with a vacuum degree of up to 15-50Pa), and then fills them with resin or ink to avoid bubbles and voids, ensuring full and uniform filling.

Core features:

High vacuum system: With a maximum vacuum degree of 15-20Pa, it completely eliminates the problems of pores and dents inside the holes, making it suitable for high aspect ratio (such as 80:1) production.

Automated design: Integrated CCD alignment system with an accuracy of 0.02mm, one click parameter setting (such as plug hole pressure and speed), reducing manual dependence.

Efficient production capacity: The dual table structure increases production capacity by 1.5-2 times, with a daily increase of 1000-2000 boards and a significant reduction in machine adjustment time to within 30 minutes.

Easy to operate: compatible with various PCB boards (hard board, soft board, carrier board), supporting automatic cleaning of mesh boards and ink addition function.

Application scenarios: Mainly used for resin, copper or silver glue filling of PCB multilayer boards, HDI boards, IC carrier boards, etc., and for processing complex processes such as through holes, blind holes, and back drilling.

Performance specifications:

Substrate size: maximum 825 × 1100mm, minimum 50 × 150mm; thickness range 0.1-8mm.

Hole blocking ability: The through-hole diameter is 0.1-2.0mm (aspect ratio 30:1), and the blind hole diameter is 0.05-0.5mm (aspect ratio 5:1).

Capacity: 20-40 pieces per hour, adjusted according to plate thickness and vacuum degree.

Development trend: Upgrade to full automation, such as integrating grinding lines with black light solutions and combining AGV or robotic arms to achieve unmanned production.